- 专利标题: Memory device structure with protective element
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申请号: US17324328申请日: 2021-05-19
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公开(公告)号: US11758830B2公开(公告)日: 2023-09-12
- 发明人: Hai-Dang Trinh , Hsing-Lien Lin , Cheng-Yuan Tsai
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 分案原申请号: US15821901 2017.11.24
- 主分类号: H10N70/00
- IPC分类号: H10N70/00 ; H10N70/20
摘要:
A semiconductor device structure is provided. The structure includes a semiconductor substrate and a data storage element over the semiconductor substrate. The structure also includes an ion diffusion barrier element over the data storage element and a protective element extending along a sidewall of the ion diffusion barrier element. A bottom surface of the protective element is between a top surface of the data storage element and a bottom surface of the data storage element. The structure further includes a first electrode electrically connected to the data storage element and a second electrode electrically connected to the data storage element.
公开/授权文献
- US20210273161A1 MEMORY DEVICE STRUCTURE 公开/授权日:2021-09-02
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