- 专利标题： Thermal packaging with fan out wafer level processing
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申请号： US17663072申请日： 2022-05-12
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公开(公告)号： US11756861B2公开(公告)日： 2023-09-12
- 发明人: Ashley J. M. Erickson , Matthew J. Traverso , Sandeep Razdan , Joyce J. M. Peternel , Aparna R. Prasad
- 申请人： Cisco Technology, Inc.
- 申请人地址： US CA San Jose
- 专利权人： Cisco Technology, Inc.
- 当前专利权人： Cisco Technology, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Patterson + Sheridan, LLP
- 分案原申请号： US16836825 2020.03.31
- 主分类号： H01L23/473
- IPC分类号： H01L23/473 ; H01L21/48 ; H01L21/683 ; H01L23/00 ; H01L21/78 ; H01L23/544
摘要：
An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.
公开/授权文献
- US20220278022A1 THERMAL PACKAGING WITH FAN OUT WAFER LEVEL PROCESSING 公开/授权日：2022-09-01
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