发明授权
- 专利标题: Forming high carbon content flowable dielectric film with low processing damage
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申请号: US16251526申请日: 2019-01-18
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公开(公告)号: US11756786B2公开(公告)日: 2023-09-12
- 发明人: Benjamin D. Briggs , Donald F. Canaperi , Huy Cao , Thomas J. Haigh, Jr. , Son Nguyen , Hosadurga Shobha , Devika Sil , Han You
- 申请人: International Business Machines Corporation
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Cantor Colburn LLP
- 代理商 Peter Edwards
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; C23C16/30 ; C23C16/56 ; H01L21/768 ; C23C16/48 ; B05D1/00 ; B05D3/06 ; B05D3/02
摘要:
A method of fabricating a dielectric film includes depositing a first precursor on a substrate. The first precursor includes a cyclic carbosiloxane group comprising a six-membered ring. The method also includes depositing a second precursor on the substrate. The first precursor and the second precursor form a preliminary film on the substrate, and the second precursor includes silicon, carbon, and hydrogen. The method further includes exposing the preliminary film to energy from an energy source to form a porous dielectric film.
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