Invention Grant
- Patent Title: Electronic apparatus and structure
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Application No.: US17305949Application Date: 2021-07-19
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Publication No.: US11751341B2Publication Date: 2023-09-05
- Inventor: Tatsuya Ushioda , Jun Iwasaki , Masaaki Bandoh , Ryota Watanabe , Hiroshi Yamazaki
- Applicant: LENOVO (SINGAPORE) PTE. LTD.
- Applicant Address: SG Singapore
- Assignee: LENOVO (SINGAPORE) PTE. LTD.
- Current Assignee: LENOVO (SINGAPORE) PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: SHIMOKAJI IP
- Priority: JP 20151844 2020.09.10
- Main IPC: H05K5/00
- IPC: H05K5/00 ; F16B43/00 ; G06F1/16 ; H05K7/20 ; F16B35/00

Abstract:
An electronic apparatus includes a bottom cover, a main board provided with a stud, a screw, a washer, and a sponge. The screw has a head portion having a diameter larger than that of an attachment hole, a male screw portion configured to be screwed into a first female screw portion, and a columnar portion having a diameter smaller than a root diameter of the male screw portion. The washer has a flange portion having a diameter larger than that of the attachment hole, a cylindrical portion having a diameter smaller than that of the attachment hole, and a second female screw portion which the male screw portion is screwable into and passable through. The head portion abuts on the bottom cover to fix the bottom cover by the male screw portion. The flange portion is between the stud and the bottom cover.
Public/Granted literature
- US20220078924A1 ELECTRONIC APPARATUS AND STRUCTURE Public/Granted day:2022-03-10
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