Invention Grant
- Patent Title: Memory device
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Application No.: US17401251Application Date: 2021-08-12
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Publication No.: US11744060B2Publication Date: 2023-08-29
- Inventor: Huai-Ying Huang , Yu-Ming Lin
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H10B10/00
- IPC: H10B10/00 ; H01L29/786 ; H01L27/092

Abstract:
A memory device is provided. The memory device includes a plurality of memory cells. Each memory cell includes a latch circuit formed of N-type field effect transistors (NFETs) and P-type field effect transistors (PFETs). The NFETs are formed at a surface of a semiconductor substrate, and the PFETs are disposed at an elevated level over the NFETs.
Public/Granted literature
- US20230050415A1 MEMORY DEVICE Public/Granted day:2023-02-16
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