- 专利标题： Semiconductor device and manufacturing method of the same
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申请号： US17461479申请日： 2021-08-30
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公开(公告)号： US11721597B2公开(公告)日： 2023-08-08
- 发明人: Yang-Che Chen , Chen-Hua Lin , Victor Chiang Liang , Huang-Wen Tseng , Chwen-Ming Liu
- 申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 当前专利权人地址： TW Hsinchu
- 代理机构： WPAT Law
- 代理商 Anthony King
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; H01L23/40 ; H01L23/58 ; H01L23/00 ; H01L25/065
摘要：
A semiconductor device and a method for detecting a defect in a semiconductor device are provided. The semiconductor device includes a packaging structure. The packaging structure includes a redistribution layer and a detecting component disposed in the redistribution layer. The semiconductor device further includes a cooling plate over the packaging structure and a fixing component penetrating through the packaging structure and the cooling plate. The packaging structure and the cooling plate are fixed by the fixing component. The detecting component is in a chain configuration having a ring shaped structure circling around the fixing component.
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