- 专利标题： Magnetic component structure with thermal conductive filler and method of fabricating the same
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申请号： US16809511申请日： 2020-03-04
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公开(公告)号： US11710595B2公开(公告)日： 2023-07-25
- 发明人: Yi-Ting Lai , Jen-Chuan Hsiao , Yuan-Ming Chang , Hsieh-Shen Hsieh
- 申请人： CYNTEC CO., LTD.
- 申请人地址： TW Hsinchu
- 专利权人： CYNTEC CO., LTD.
- 当前专利权人： CYNTEC CO., LTD.
- 当前专利权人地址： TW Hsinchu
- 代理商 Winston Hsu
- 主分类号： H01F27/22
- IPC分类号： H01F27/22 ; H01F27/24 ; H01F27/28 ; H01F27/02 ; H01F41/04 ; H01F1/147 ; H01F1/34 ; H01F41/02 ; H01F27/32
摘要：
An magnetic component structure with thermal conductive filler is provided in the present invention, including an upper magnetic core, a lower magnetic core combining with the upper magnetic core to form a casing with a front opening and a rear opening, and a coil mounted in the casing, where two terminals of the coil extend outwardly from the front opening, and a thermal conductive filler filling between the casing and the coil in the casing.
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