- 专利标题: Semiconductor device and manufacturing method of semiconductor device
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申请号: US17369484申请日: 2021-07-07
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公开(公告)号: US11706999B2公开(公告)日: 2023-07-18
- 发明人: Chien-Min Lee , Shy-Jay Lin , Yen-Lin Huang , MingYuan Song , Tung Ying Lee
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Slater Matsil, LLP
- 主分类号: H01L43/00
- IPC分类号: H01L43/00 ; H01L43/04 ; H01L43/14 ; H01L27/22 ; H01L43/10
摘要:
Semiconductor device includes pair of active devices, composite spin Hall electrode, and a magnetic tunnel junction. Composite spin Hall electrode is electrically connected to pair of active devices. Magnetic tunnel junction is disposed on opposite side of composite spin hall electrode with respect to pair of active devices. Spin Hall electrode includes pair of heavy metal layers, and spacer layer disposed in between pair of heavy metal layers. Pair of heavy metal layers is made of a heavy metal in a metastable state. Spacer layer comprises first material different from the pair of heavy metal layers.
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