Invention Grant
- Patent Title: Envelope ratio method to improve beam hierarchy design
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Application No.: US17457875Application Date: 2021-12-06
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Publication No.: US11705953B2Publication Date: 2023-07-18
- Inventor: Ting Kong , Farhad Meshkati , Mihir Vijay Laghate , Raghu Narayan Challa
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Main IPC: H04B7/06
- IPC: H04B7/06

Abstract:
A first wireless device may select a first beam for communication with a second wireless device from a first set of beams associated with a first beam level. A second set of beams may be associated with a second beam level. The first beam may be associated with a first children list. The first children list may be associated with a first subset of beams of the second set of beams. Each beam in the first subset of beams may have an envelope area that intersects an envelope area of the first beam. The first wireless device may select a second beam for communication with the second wireless device from the first subset of beams based on an envelope area of the second beam intersecting the envelope area of the first beam. The first wireless device may communicate with the second wireless device.
Public/Granted literature
- US20230179282A1 ENVELOPE RATIO METHOD TO IMPROVE BEAM HIERARCHY DESIGN Public/Granted day:2023-06-08
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