- 专利标题: Multi-layer ceramic electronic component, circuit board, and method of producing a multi-layer ceramic electronic component
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申请号: US17235791申请日: 2021-04-20
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公开(公告)号: US11705278B2公开(公告)日: 2023-07-18
- 发明人: Kunihiro Matsushita , Takashi Sasaki
- 申请人: TAIYO YUDEN CO., LTD.
- 申请人地址: JP Tokyo
- 专利权人: TAIYO YUDEN CO., LTD.
- 当前专利权人: TAIYO YUDEN CO., LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Law Office of Katsuhiro Arai
- 优先权: JP 20077031 2020.04.24
- 主分类号: H01G4/012
- IPC分类号: H01G4/012 ; H01G4/30 ; H01G2/06 ; H01G4/008 ; H01G4/12
摘要:
A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes an end surface facing in a first direction, and internal electrodes exposed from the end surface and laminated in a second direction orthogonal to the first direction. The external electrode is provided on the end surface and includes two protrusions that are formed along two peripheral portions of the end surface and protrude in the first direction, the two peripheral portions being disposed in a third direction orthogonal to the first direction and the second direction.
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