- Patent Title: Dynamic presentation of interconnect protocol capability structures
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Application No.: US17387261Application Date: 2021-07-28
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Publication No.: US11704275B2Publication Date: 2023-07-18
- Inventor: Kuan Hua Tan , Eng Hun Ooi , Ang Li
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alliance IP, LLC
- The original application number of the division: US16513941 2019.07.17
- Main IPC: G06F13/42
- IPC: G06F13/42 ; G06F9/445

Abstract:
A device connected by a link to a host system can include a first port to receive a capability configuration message across a link and a message request receiving logic comprising hardware circuitry to identify a capability of the device identified in the capability configuration message, determine that the capability is to be presented or hidden from operation based on a capability hide enable bit in the capability configuration message, and configure a capability linked list to present or hide the capability based on the determination. The device can also include a message response generator logic comprising hardware circuitry to generate a response message indicating that the capability is to be presented or hidden from operation. The device can include a second port to transmit the response message across the link.
Public/Granted literature
- US20210357350A1 DYNAMIC PRESENTATION OF INTERCONNECT PROTOCOL CAPABILITY STRUCTURES Public/Granted day:2021-11-18
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