- 专利标题: Array substrate and preparation method thereof, and digital microfluidic chip
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申请号: US17044027申请日: 2020-03-19
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公开(公告)号: US11699772B2公开(公告)日: 2023-07-11
- 发明人: Xue Dong , Yue Geng , Peizhi Cai
- 申请人: Beijing BOE Sensor Technology Co., Ltd. , BOE Technology Group Co., Ltd.
- 申请人地址: CN Beijing
- 专利权人: Beijing BOE Sensor Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- 当前专利权人: Beijing BOE Sensor Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- 当前专利权人地址: CN Beijing; CN Beijing
- 代理机构: IPro, PLLC
- 优先权: CN 1910256479.8 2019.04.01
- 国际申请: PCT/CN2020/080258 2020.03.19
- 国际公布: WO2020/199936A 2020.10.08
- 进入国家日期: 2020-09-30
- 主分类号: H01L31/18
- IPC分类号: H01L31/18 ; H01L27/144 ; H01L31/0224 ; B01L3/00
摘要:
Disclosed are an array substrate and a preparation method thereof, and a digital microfluidic chip. The preparation method includes: forming a plurality of photoelectric detection devices on a silicon-based substrate; transferring the photoelectric detection devices to a base substrate by adopting a micro transfer printing process; and forming a plurality of transparent driving electrodes on the base substrate, wherein the transparent driving electrodes are insulated from the photoelectric detection devices.
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