- 专利标题: Heat sealed lid and can
-
申请号: US16764290申请日: 2018-12-07
-
公开(公告)号: US11697539B2公开(公告)日: 2023-07-11
- 发明人: Nobuo Kadowaki , Kazushi Iwakiri , Tomohiro Mizutani , Satoshi Kato
- 申请人: NIPPON STEEL CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: NIPPON STEEL CORPORATION
- 当前专利权人: NIPPON STEEL CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 优先权: JP 17234894 2017.12.07
- 国际申请: PCT/JP2018/045134 2018.12.07
- 国际公布: WO2019/112051A 2019.06.13
- 进入国家日期: 2020-05-14
- 主分类号: B32B15/085
- IPC分类号: B32B15/085 ; B32B15/09 ; B32B15/20 ; B32B27/32 ; B32B27/36 ; B32B7/12 ; B65D17/34 ; B65D77/20
摘要:
A heat sealed lid includes: a resin laminate aluminum foil; and a first seamed side frame portion and a second seamed side frame portion formed of a resin film laminate metal sheet, in which the resin film laminate metal sheet includes a metal sheet, a laminate film formed on one surface of the metal sheet, and a second resin film formed on the other surface of the metal sheet and containing a thermoplastic polyester resin, the laminate film includes an adhesion layer containing a polypropylene-based resin and a polyethylene-based resin and a base layer containing a modified polypropylene-based resin, an amount of the polyethylene-based resin in the adhesion layer is 1.0 mass % or more and 45.0 mass % or less of the resins of the adhesion layer, the melting point of the second resin film is higher than the melting point of the adhesion layer by 40° C. or more and is higher than the heating temperature of a heat sealing tool, the thickness of the adhesion layer is 1.0 μm or more and 15.0 μm or less, and the thickness of the base layer is 1.0 μm or more and 18.0 μm or less.
公开/授权文献
- US20200346831A1 HEAT SEALED LID AND CAN 公开/授权日:2020-11-05
信息查询