- 专利标题： Chip electronic component
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申请号： US17137498申请日： 2020-12-30
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公开(公告)号： US11688555B2公开(公告)日： 2023-06-27
- 发明人: Yukihiro Fujita , Shogo Kanbe , Kosuke Nakano , Hideki Otsuka
- 申请人： Murata Manufacturing Co., Ltd.
- 申请人地址： JP Nagaokakyo
- 专利权人： MURATA MANUFACTURING CO., LTD.
- 当前专利权人： MURATA MANUFACTURING CO., LTD.
- 当前专利权人地址： JP Kyoto
- 代理机构： Keating & Bennett, LLP
- 优先权： JP 16233717 2016.12.01
- 主分类号： H01G2/06
- IPC分类号： H01G2/06 ; H01G4/232 ; H01G4/30 ; H01G4/12 ; H01G4/252
摘要：
A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.
公开/授权文献
- US20210118614A1 CHIP ELECTRONIC COMPONENT 公开/授权日：2021-04-22
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