- 专利标题: Switching power supply module and packaging method thereof
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申请号: US15931609申请日: 2020-05-14
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公开(公告)号: US11657947B2公开(公告)日: 2023-05-23
- 发明人: Wenjie Wang , Dafu Lu
- 申请人: Shenzhen Sunlord Electronics Co., Ltd.
- 申请人地址: CN Guangdong
- 专利权人: Shenzhen Sunlord Electronics Co., Ltd.
- 当前专利权人: Shenzhen Sunlord Electronics Co., Ltd.
- 当前专利权人地址: CN Guangdong
- 代理商 Winston Hsu
- 优先权: CN 1711161014.1 2017.11.20
- 主分类号: H01F27/28
- IPC分类号: H01F27/28 ; H01F27/24 ; H01F27/29 ; H01L23/495 ; H01L23/00 ; H01L25/16 ; H01F41/02
摘要:
A switching power supply module includes a power inductor which includes a magnetic core and L-shaped metal end electrodes and a switching power supply chip which includes a packaging body, a bare chip and a bottom bonding pad of the bare chip; the L-shaped metal end electrode includes a first electrode part which is welded at 90° to the magnetic core and a second electrode part which extends in parallel from the first electrode part to the middle of the magnetic core and is perpendicular to the first electrode part; the bare chip and the packaging body are embedded between the first, the second electrode part and the magnetic core; the bottom bonding pad abuts between the two second electrode parts and is insulated from the second electrode part, and the weld face of the bottom bonding pad is flush with that of the second electrode part.
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