Invention Grant
- Patent Title: Integrated circuit device
-
Application No.: US17168952Application Date: 2021-02-05
-
Publication No.: US11647627B2Publication Date: 2023-05-09
- Inventor: Jiseok Hong , Sangho Lee , Seoryong Park , Jiyoung Ahn , Kiseok Lee , Kiseok Lee , Yoonyoung Choi , Seunguk Han
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR 20200076763 2020.06.23
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
An integrated circuit device includes: a substrate including a plurality of active regions; a bit line extending on the substrate in a horizontal direction; a direct contact connected between a first active region selected among the plurality of active regions and the bit line; an inner oxide layer contacting a sidewall of the direct contact; and a carbon-containing oxide layer nonlinearly extending on a sidewall of the bit line in a vertical direction, the carbon-containing oxide layer contacting the sidewall of the bit line.
Public/Granted literature
- US20210398569A1 INTEGRATED CIRCUIT DEVICE Public/Granted day:2021-12-23
Information query
IPC分类: