- 专利标题: Transistor device with variously conformal gate dielectric layers
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申请号: US16363632申请日: 2019-03-25
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公开(公告)号: US11616130B2公开(公告)日: 2023-03-28
- 发明人: Seung Hoon Sung , Jack Kavalieros , Ian Young , Matthew Metz , Uygar Avci , Devin Merrill , Ashish Verma Penumatcha , Chia-Ching Lin , Owen Loh
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Essential Patents Group, LLP
- 主分类号: H01L29/49
- IPC分类号: H01L29/49 ; H01L29/51 ; H01L29/78 ; H01L29/66 ; H01L21/28
摘要:
Techniques and mechanisms to provide electrical insulation between a gate and a channel region of a non-planar circuit device. In an embodiment, the gate structure, and insulation spacers at opposite respective sides of the gate structure, each extend over a semiconductor fin structure. In a region between the insulation spacers, a first dielectric layer extends conformally over the fin, and a second dielectric layer adjoins and extends conformally over the first dielectric layer. A third dielectric layer, adjoining the second dielectric layer and the insulation spacers, extends under the gate structure. Of the first, second and third dielectric layers, the third dielectric layer is conformal to respective sidewalls of the insulation spacers. In another embodiment, the second dielectric layer is of dielectric constant which is greater than that of the first dielectric layer, and equal to or less than that of the third dielectric layer.
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