- 专利标题： Semiconductor package structure and method for manufacturing the same
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申请号： US16852259申请日： 2020-04-17
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公开(公告)号： US11605597B2公开(公告)日： 2023-03-14
- 发明人: Hsu-Nan Fang , Chun-Jun Zhuang
- 申请人： Advanced Semiconductor Engineering, Inc.
- 申请人地址： TW Kaohsiung
- 专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址： TW Kaohsiung
- 代理机构： Foley & Lardner LLP
- 主分类号： H01L23/544
- IPC分类号： H01L23/544 ; H01L23/31 ; H01L23/00 ; H01L21/56 ; H01L23/18 ; H01L27/148
摘要：
A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first passivation layer, a first metal layer and a first semiconductor die. The first metal layer is embedded in the first passivation layer. The first metal layer defines a first through-hole. The first semiconductor die is disposed on the first passivation layer.
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