发明授权
- 专利标题: Multistage, microchannel condensers with displaced manifolds for use in HVAC systems
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申请号: US16997911申请日: 2020-08-19
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公开(公告)号: US11604015B2公开(公告)日: 2023-03-14
- 发明人: Colin Patrick Clara
- 申请人: Lennox Industries Inc.
- 申请人地址: US TX Richardson
- 专利权人: Lennox Industries Inc.
- 当前专利权人: Lennox Industries Inc.
- 当前专利权人地址: US TX Richardson
- 代理机构: Johnston IP Law, PLLC
- 主分类号: F25B39/00
- IPC分类号: F25B39/00 ; F25B7/00 ; F28F1/02 ; F25B39/04 ; F28F9/02 ; F28D1/04 ; F28F1/12 ; F28D1/053 ; F28D21/00
摘要:
In one instance, a multistage microchannel condenser is provided for use as an aspect of a heating, ventilating, and air conditioning (HVAC) system. The multistage microchannel condenser includes at least two pluralities of flat tubes having microchannels, each associated with a different refrigeration circuit, that are interspersed so that when only one refrigeration circuit is operational, the multistage microchannel condenser still does not have any substantial thermal dead spots. Manifolds are used on each end of the multistage microchannel condenser to fluidly couple members of the at least two pluralities of flat tubes such that the refrigerant in each refrigeration circuit remains separated while still using a majority of the area of the face of the multistage microchannel condenser. Other aspects are presented.
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