- 专利标题： Cleaning pad assembly
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申请号： US16807510申请日： 2020-03-03
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公开(公告)号： US11602799B2公开(公告)日： 2023-03-14
- 发明人: Mitsuhiko Miyazaki
- 申请人： Hakko Corporation
- 申请人地址： JP Osaka
- 专利权人： Hakko Corporation
- 当前专利权人： Hakko Corporation
- 当前专利权人地址： JP Osaka
- 代理商 David B Abel
- 优先权： JP2016-155780 20160808,JP2017-002301 20170111
- 主分类号： B23K3/02
- IPC分类号： B23K3/02 ; B23K3/08 ; B23K3/04 ; B08B1/00 ; B23K1/018 ; B08B7/00
摘要：
The invention details the designs of cleaning pad assemblies for use with heating tools including for example soldering cartridges and soldering irons. The cleaning pads of the assembly are designed to effectively remove and clean the solder from heating tools during and at the end of soldering operations, and allow the collection of the removed solder.
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