The present disclosure provides a semiconductor package, including a substrate, a semiconductor die, and a conductive bump. The substrate has a first surface and a second surface opposite to the first surface. The substrate further includes a conductive line surrounded by a dielectric, and a conductive via connected to the conductive line and protruding from the dielectric at the second surface. The semiconductor die is connected to the first surface of the substrate. The conductive bump is connected to the conductive via at the second surface.