发明授权
- 专利标题: Heat sink, board module, transmission device, and method of manufacturing the heat sink
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申请号: US16812843申请日: 2020-03-09
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公开(公告)号: US11561051B2公开(公告)日: 2023-01-24
- 发明人: Yuji Shioya , Mitsuru Etou , Tomoyuki Hongoh , Ryo Matsumoto , Kazuhiko Ohta
- 申请人: FUJITSU LIMITED
- 申请人地址: JP Kawasaki
- 专利权人: FUJITSU LIMITED
- 当前专利权人: FUJITSU LIMITED
- 当前专利权人地址: JP Kawasaki
- 代理机构: Fujitsu Patent Center
- 优先权: JPJP2019-055209 20190322
- 主分类号: F28F3/06
- IPC分类号: F28F3/06 ; F28F3/02
摘要:
A heat sink includes: a base plate; and at least one fin secured to the base plate; wherein the base plate has at least one through hole that extends in a first direction parallel to a surface of the base plate, wherein the at least one fin has a projection inserted into the at least one through hole, and wherein, in a second direction that is parallel to the surface of the base plate and that is perpendicular to the first direction, both end surfaces of the projection are in contact with inner wall surfaces of the at least one through hole entirely in a third direction parallel to a thickness direction of the base plate.
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