Invention Grant
- Patent Title: Device-to-device signaling
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Application No.: US16711068Application Date: 2019-12-11
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Publication No.: US11553542B2Publication Date: 2023-01-10
- Inventor: Hong Cheng , Zhibin Wu , Sudhir Kumar Baghel , Kapil Gulati
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Harrity & Harrity, LLP
- Agent Danai Nelisile Mhembere
- Main IPC: H04W76/14
- IPC: H04W76/14 ; H04W76/27 ; H04W48/16 ; H04W4/40 ; H04W80/02

Abstract:
Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a first user equipment (UE) may encapsulate, into a link layer sidelink management message, upper layer signaling for managing a direct communication connection with a second UE. The first UE may transmit, to the second UE, the link layer sidelink management message including the upper layer signaling. The second UE may selectively transmit, to the first UE, a link layer sidelink response message based at least in part on a content of the upper layer signaling in the link layer sidelink management message. Numerous other aspects are provided.
Public/Granted literature
- US20200229249A1 DEVICE-TO-DEVICE SIGNALING Public/Granted day:2020-07-16
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