- 专利标题: Electronic cooling systems
-
申请号: US15930611申请日: 2020-05-13
-
公开(公告)号: US11533828B2公开(公告)日: 2022-12-20
- 发明人: Delmar L. Barker , Paul M. Lyons
- 申请人: RAYTHEON COMPANY
- 申请人地址: US MA Waltham
- 专利权人: RAYTHEON COMPANY
- 当前专利权人: RAYTHEON COMPANY
- 当前专利权人地址: US MA Waltham
- 代理机构: Cantor Colburn LLP
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; F25B9/02
摘要:
Disclosed herein are cooling systems, methods of making cooling systems, and methods of cooling using cooling systems. A cooling system includes a compression container with a coolant that includes a fluid. A valve is arranged on the compression container through which the coolant is released from the compression container. The cooling system further includes a component positioned to receive droplets of the coolant. The component has a surface with a three-dimensional topography that includes a plurality of pillars and a plurality of trenches. The component is an electronic component or a photoelectronic component.
公开/授权文献
- US20210360830A1 ELECTRONIC COOLING SYSTEMS 公开/授权日:2021-11-18
信息查询