- 专利标题: Integral features providing improved flexible printed circuit folding and connection capability
-
申请号: US17120416申请日: 2020-12-14
-
公开(公告)号: US11533807B2公开(公告)日: 2022-12-20
- 发明人: David R. Peterson , Joseph Sudik, Jr. , David G. Siegfried , Jared Bilas
- 申请人: APTIV TECHNOLOGIES LIMITED
- 申请人地址: BB St. Michael
- 专利权人: APTIV TECHNOLOGIES LIMITED
- 当前专利权人: APTIV TECHNOLOGIES LIMITED
- 当前专利权人地址: BB St. Michael
- 代理机构: RMCK Law Group, PLC
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K3/00
摘要:
A flexible circuit (FC) and a method of forming the FC each include providing a first dielectric layer, applying a plurality of conductive circuit traces that are substantially parallel to each other to the first dielectric layer, providing a second dielectric layer atop the first dielectric layer and the plurality of conductive circuit traces to form a third dielectric layer having the plurality of conductive traces disposed therein and being configured to support and insulate the plurality of conductive traces, and forming a plurality of channels extending at least partially through a thickness of the third dielectric layer, wherein the plurality of channels are arranged between the plurality of conductive circuit traces and substantially parallel thereto and are configured to provide increased flexibility of the FC.
公开/授权文献
信息查询