- 专利标题： Antenna apparatus and method
-
申请号： US16826538申请日： 2020-03-23
-
公开(公告)号： US11532868B2公开(公告)日： 2022-12-20
- 发明人: Lai Wei Chih , Monsen Liu , En-Hsiang Yeh , Chuei-Tang Wang , Chen-Hua Yu
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01Q1/22 ; H01L23/00 ; H01L23/66 ; H01L21/48 ; H01L21/56 ; H01L23/48 ; H01L23/498 ; H01L23/522 ; H01Q1/36 ; H01Q9/04
摘要：
An antenna apparatus comprises a semiconductor die in a molding compound layer, a first through via is between a sidewall of the semiconductor die and a sidewall of the molding compound layer and an antenna structure over the molding compound layer, wherein a first portion of the antenna structure is directly over a top surface of the semiconductor die and a second portion of the antenna structure is directly over a top surface of the first through via.
公开/授权文献
- US20200220250A1 Antenna Apparatus and Method 公开/授权日：2020-07-09
信息查询
IPC分类:
