- 专利标题: Semiconductor structure and method of forming the same
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申请号: US17134694申请日: 2020-12-28
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公开(公告)号: US11532617B2公开(公告)日: 2022-12-20
- 发明人: Po-Chao Tsao
- 申请人: MEDIATEK INC.
- 申请人地址: TW Hsinchu
- 专利权人: MEDIATEK INC.
- 当前专利权人: MEDIATEK INC.
- 当前专利权人地址: TW Hsinchu
- 代理机构: McClure, Qualey & Rodack, LLP
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L29/06 ; H01L29/423 ; H01L29/786 ; H01L21/02 ; H01L29/66
摘要:
A semiconductor structure includes the first semiconductor stack and the second semiconductor stack formed over the first region and the second region of a substrate, respectively. The first and second semiconductor stacks extend in the first direction and are spaced apart from each other in the second direction. Each of the first semiconductor stack and the second semiconductor stack includes channel layers and a gate structure. The channel layers are formed above the substrate and are spaced apart from each other in the third direction. The gate structure includes the gate dielectric layers formed around the respective channel layers, and the gate electrode layer formed on the gate dielectric layers to surround the channel layers. The number of channel layers in the first semiconductor stack is different from the number of channel layers in the second semiconductor stack.
公开/授权文献
- US20210313317A1 SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME 公开/授权日:2021-10-07
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