- 专利标题： Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors
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申请号： US16390482申请日： 2019-04-22
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公开(公告)号： US11532529B2公开(公告)日： 2022-12-20
- 发明人: Chen-Hua Yu , Kuo-Chung Yee , Hao-Yi Tsai , Tin-Hao Kuo
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/00 ; H01L23/538 ; H01L21/48 ; H01L21/56 ; H01L23/29 ; H01L23/498
摘要：
A method includes forming a through-via from a first conductive pad of a first device die. The first conductive pad is at a top surface of the first device die. A second device die is adhered to the top surface of the first device die. The second device die has a surface conductive feature. The second device die and the through-via are encapsulated in an encapsulating material. The encapsulating material is planarized to reveal the through-via and the surface conductive feature. Redistribution lines are formed over and electrically coupled to the through-via and the surface conductive feature.
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