- 专利标题: Ceramic electronic device, mounting substrate, package body of ceramic electronic device, and manufacturing method of ceramic electronic device
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申请号: US16796162申请日: 2020-02-20
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公开(公告)号: US11532434B2公开(公告)日: 2022-12-20
- 发明人: Atsushi Imai
- 申请人: TAIYO YUDEN CO., LTD.
- 申请人地址: JP Tokyo
- 专利权人: TAIYO YUDEN CO., LTD.
- 当前专利权人: TAIYO YUDEN CO., LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Chen Yoshimura LLP
- 优先权: JPJP2019-031800 20190225
- 主分类号: H01G4/012
- IPC分类号: H01G4/012 ; H01G4/30 ; H01G4/12
摘要:
A ceramic electronic device includes: a multilayer chip having a multilayer structure and a cover layer, the multilayer structure having a structure in which each of dielectric layers and each of internal electrode layers are alternately stacked, respective one ends of the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer structure, the cover layer being provided on each of an upper face and a lower face of the multilayer structure in a stacking direction of the multilayer structure, a main component of the cover layer being ceramic, wherein in each of two side faces of the multiplayer structure, a color of a first region is different from a color of a second region that is positioned at a height different from the first region in the stacking direction.
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