Invention Grant
- Patent Title: Gate-all-around integrated circuit structures having source or drain structures with epitaxial nubs
-
Application No.: US16361861Application Date: 2019-03-22
-
Publication No.: US11522048B2Publication Date: 2022-12-06
- Inventor: Cory Bomberger , Anand Murthy , Mark T. Bohr , Tahir Ghani , Biswajeet Guha
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/66 ; H01L29/423 ; H01L29/78 ; H01L29/417

Abstract:
Gate-all-around integrated circuit structures having source or drain structures with epitaxial nubs, and methods of fabricating gate-all-around integrated circuit structures having source or drain structures with epitaxial nubs, are described. For example, an integrated circuit structure includes a first vertical arrangement of horizontal nanowires and a second vertical arrangement of horizontal nanowires. A first pair of epitaxial source or drain structures includes vertically discrete portions aligned with the first vertical arrangement of horizontal nanowires. A second pair of epitaxial source or drain structures includes vertically discrete portions aligned with the second vertical arrangement of horizontal nanowires. A conductive contact structure is laterally between and in contact with the one of the first pair of epitaxial source or drain structures and the one of the second pair of epitaxial source or drain structures.
Public/Granted literature
- US20200303502A1 GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING SOURCE OR DRAIN STRUCTURES WITH EPITAXIAL NUBS Public/Granted day:2020-09-24
Information query
IPC分类: