- 专利标题: Integrated circuit structure with hybrid cell design
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申请号: US16900768申请日: 2020-06-12
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公开(公告)号: US11515308B2公开(公告)日: 2022-11-29
- 发明人: Kam-Tou Sio , Jiann-Tyng Tzeng
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Maschoff Brennan
- 主分类号: H01L27/092
- IPC分类号: H01L27/092 ; G06F30/392
摘要:
An IC structure includes first and second cell rows extending in a first direction. The first cell row includes first cells each including one or more first fins having first source/drain regions of a first conductivity type and one or more second fins having second source/drain regions of a second conductivity type opposite the first conductivity type. The second cell row includes second cells each including one or more third fins having third source/drain regions of the first conductivity type and one or more fourth fins having fourth source/drain regions of the second conductivity type. The first cells have a same first number of the one or more first fins, and the second cells have a same second number of the one or more third fins less than the first number of the one or more first fins.
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