Invention Grant
- Patent Title: Method to enhance magnetic strength and robustness of rear hard bias for dual free layer read
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Application No.: US17398714Application Date: 2021-08-10
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Publication No.: US11514933B1Publication Date: 2022-11-29
- Inventor: Chen-Jung Chien , Ming Mao , Daniele Mauri
- Applicant: Western Digital Technologies, Inc.
- Applicant Address: US CA San Jose
- Assignee: Western Digital Technologies, Inc.
- Current Assignee: Western Digital Technologies, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Patterson & Sheridan, LLP
- Agent Steven H. VerSteeg
- Main IPC: G11B5/39
- IPC: G11B5/39

Abstract:
The present disclosure generally relates to read heads having dual free layer (DFL) sensors. The read head has a sensor disposed between two shields. The sensor is a DFL sensor and has a surface at the media facing surface (MFS). Recessed from the DFL sensor, and from the MFS, is a rear hard bias (RHB) structure. The RHB structure is disposed between the shields as well. In between the DFL sensor and the RHB structure is insulating material. The RHB is disposed on the insulating material. The RHB includes a RHB seed layer as well as a RHB bulk layer. The RHB bulk layer includes a first bulk layer and a second bulk layer, the first bulk layer having a different density relative to the second bulk layer.
Information query
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