Invention Grant
- Patent Title: Smart egress in service mesh
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Application No.: US17569633Application Date: 2022-01-06
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Publication No.: US11489939B1Publication Date: 2022-11-01
- Inventor: Sudheesh S. Kairali , Sarbajit K. Rakshit
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Jared L. Montanaro
- Main IPC: H04L67/568
- IPC: H04L67/568

Abstract:
A processor may receive a microservice chain. The processor may analyze the microservice chain for one or more microservices in the microservice chain that include deducible information. The processor may trigger, from the deducible information, a deduced microservice. The processor may process the deduced microservice. The processor may cache an outcome from the deduced microservice.
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