- 专利标题: Method for producing bonded body, method for producing insulated circuit board, and method for producing insulated circuit board with heatsink
-
申请号: US16491028申请日: 2018-02-28
-
公开(公告)号: US11478868B2公开(公告)日: 2022-10-25
- 发明人: Ryouhei Yumoto , Yoshiyuki Nagatomo , Soutarou Ooi
- 申请人: MITSUBISHI MATERIALS CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: MITSUBISHI MATERIALS CORPORATION
- 当前专利权人: MITSUBISHI MATERIALS CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Locke Lord LLP
- 代理商 James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- 优先权: JPJP2017-053689 20170317
- 国际申请: PCT/JP2018/007598 WO 20180228
- 国际公布: WO2018/168476 WO 20180920
- 主分类号: H01L33/48
- IPC分类号: H01L33/48 ; H01L21/48 ; B23K1/00 ; H01L23/12 ; H01L23/36 ; B23K101/42
摘要:
A method for producing a bonded body includes: a laminating step of forming a laminated body in which a first member and a second member are temporarily bonded to each other by providing a temporary bonding material including an organic material on at least one of a bonding surface of the first member and a bonding surface of the second member; and a bonding step of pressurizing and heating the laminated body in a laminating direction and bonding the first member and the second member to each other. In the bonding step, during a temperature increase process of heating the laminated body up to a predetermined bonding temperature, at least a pressurization load P2 at a decomposition temperature TD of the organic material included in the temporary bonding material is lower than a pressurization load P1 at the bonding temperature.
公开/授权文献
信息查询
IPC分类: