- 专利标题: Electronic device and electronic device housing structure
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申请号: US16969086申请日: 2019-02-11
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公开(公告)号: US11463570B2公开(公告)日: 2022-10-04
- 发明人: Minwoo Yoo , Hyeongsam Son , Byounguk Yoon , Minsung Lee , Chongkun Cho , Jongchul Choi , Changryong Heo
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Gyeonggi-do
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: The Farrell Law Firm, P.C.
- 优先权: KR10-2018-0017117 20180212
- 国际申请: PCT/KR2019/001633 WO 20190211
- 国际公布: WO2019/156519 WO 20190815
- 主分类号: H05K5/03
- IPC分类号: H05K5/03 ; H04M1/02 ; H05K5/00 ; H05K5/02
摘要:
Various embodiments disclosed in this document relate to an electronic device, for example, an electronic device comprising a conductive piece facing a housing of a metallic material, and an electronic device housing structure.
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