Invention Grant
- Patent Title: Integrated circuit structures having asymmetric source and drain structures
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Application No.: US16147538Application Date: 2018-09-28
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Publication No.: US11462536B2Publication Date: 2022-10-04
- Inventor: Anupama Bowonder , Rishabh Mehandru , Mark Bohr , Tahir Ghani
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L27/092 ; H01L21/8238 ; H01L29/06 ; H01L29/08 ; H01L29/423 ; H01L29/66 ; H01L29/78

Abstract:
Integrated circuit structures having asymmetric source and drain structures, and methods of fabricating integrated circuit structures having asymmetric source and drain structures, are described. For example, an integrated circuit structure includes a fin, and a gate stack over the fin. A first epitaxial source or drain structure is in a first trench in the fin at a first side of the gate stack. A second epitaxial source or drain structure is in a second trench in the fin at a second side of the gate stack, the second epitaxial source or drain structure deeper into the fin than the first epitaxial source or drain structure.
Information query
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