According to an embodiment of the invention, a laser processing method includes a first irradiation process and a second irradiation process. In the first irradiation process, a first laser light is irradiated on a first region of a processing object including a metal. A first output value of the first laser light is 3000 W or more. In the second irradiation process, a second laser light is irradiated on the first region. A second output value of the second laser light is not less than 60% and not more than 70% of the first output value.