- 专利标题： Patch substrate configured as a shield located over a cavity of a board
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申请号： US17071408申请日： 2020-10-15
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公开(公告)号： US11452246B2公开(公告)日： 2022-09-20
- 发明人: Charles David Paynter , Ryan Lane , John Eaton , Amit Mano
- 申请人： QUALCOMM Incorporated
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM Incorporated
- 当前专利权人： QUALCOMM Incorporated
- 当前专利权人地址： US CA San Diego
- 代理机构： Loza & Loza, LLP/Qualcomm
- 主分类号： H05K9/00
- IPC分类号： H05K9/00 ; H05K1/02 ; H05K3/30 ; H05K5/00 ; H05K1/11
摘要：
A device that includes a board, a package and a patch substrate. The board includes a cavity. The package is coupled to a first side of the board. The package includes a substrate and an integrated device coupled to the substrate. The integrated device is located at least partially in the cavity of the board. The patch substrate is coupled to a second side of the board. The patch substrate is located over the cavity of the board. The patch substrate is configured as an electromagnetic interference (EMI) shield for the package.
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