- 专利标题： Radio frequency module and communication device
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申请号： US17105657申请日： 2020-11-27
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公开(公告)号： US11418225B2公开(公告)日： 2022-08-16
- 发明人: Kunitoshi Hanaoka , Yoichi Sawada
- 申请人： MURATA MANUFACTURING CO., LTD.
- 申请人地址： JP Nagaokakyo
- 专利权人： MURATA MANUFACTURING CO., LTD.
- 当前专利权人： MURATA MANUFACTURING CO., LTD.
- 当前专利权人地址： JP Nagaokakyo
- 代理机构： Xsensus LLP
- 优先权： JPJP2019-218972 20191203,JPJP2020-090886 20200525
- 主分类号： H04B1/00
- IPC分类号： H04B1/00 ; H04B1/04 ; H04B1/10
摘要：
A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a transmission input terminal; a first transmission amplifier disposed on the first principal surface that amplifies a transmission signal input through the transmission input terminal; and a first switch disposed on the second principal surface that connects and disconnects the transmission input terminal and the first transmission amplifier.
公开/授权文献
- US20210167803A1 RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE 公开/授权日：2021-06-03
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