Invention Grant
- Patent Title: Method of manufacturing semiconductor devices and corresponding semiconductor device
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Application No.: US17108270Application Date: 2020-12-01
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Publication No.: US11417590B2Publication Date: 2022-08-16
- Inventor: Federico Giovanni Ziglioli , Alberto Pintus , Pierangelo Magni
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Crowe & Dunlevy
- Priority: IT102019000022632 20191202
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L21/56
Abstract:
A plastic material substrate has a die mounting location for a semiconductor die. Metallic traces are formed on selected areas of the plastic material substrate, wherein the metallic traces provide electrically-conductive paths for coupling to the semiconductor die. The semiconductor die is attached onto the die mounting location. The semiconductor die attached onto the die mounting location is electrically bonded to selected ones of the metallic traces formed on the plastic material substrate. A package material is molded onto the semiconductor die attached onto the die mounting location.
Public/Granted literature
- US20210167000A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE Public/Granted day:2021-06-03
Information query
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