- 专利标题: Integrated circuit device
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申请号: US17043257申请日: 2019-03-12
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公开(公告)号: US11417378B2公开(公告)日: 2022-08-16
- 发明人: Tetsuo Endoh , Shoji Ikeda , Hiroki Koike
- 申请人: TOHOKU UNIVERSITY
- 申请人地址: JP Miyagi
- 专利权人: TOHOKU UNIVERSITY
- 当前专利权人: TOHOKU UNIVERSITY
- 当前专利权人地址: JP Miyagi
- 代理机构: Fox Rothschild LLP
- 代理商 Robert J. Sacco; Carol E. Thorstad-Forsyth
- 优先权: JPJP2018-070349 20180330
- 国际申请: PCT/JP2019/010003 WO 20190312
- 国际公布: WO2019/188252 WO 20191003
- 主分类号: G11C11/16
- IPC分类号: G11C11/16 ; G11C13/00 ; H01L43/02
摘要:
An integrated circuit device of the invention, includes: a first resistance variable memory element provided on a semiconductor substrate; a second resistance variable memory element provided on the semiconductor substrate; and a semiconductor circuit for controlling write and read of the first resistance variable memory element and the second resistance variable memory element, which is provided on the semiconductor substrate, in which the second resistance variable memory element has a write current that is smaller than a write current of the first resistance variable memory element, and the second resistance variable memory element is disposed farther from the semiconductor substrate than the first resistance variable memory element.
公开/授权文献
- US20210110857A1 INTEGRATED CIRCUIT DEVICE 公开/授权日:2021-04-15
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