- 专利标题： Component communications in system-in-package systems
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申请号： US15589823申请日： 2017-05-08
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公开(公告)号： US11416050B2公开(公告)日： 2022-08-16
- 发明人: Kevin Michael Troy , Peter Robert Linder
- 申请人： Octavo Systems LLC
- 申请人地址： US TX Austin
- 专利权人： Octavo Systems LLC
- 当前专利权人： Octavo Systems LLC
- 当前专利权人地址： US TX Austin
- 代理机构： Rothwell, Figg, Ernst & Manbeck, P.C.
- 主分类号： G06F1/26
- IPC分类号： G06F1/26 ; G06F1/22 ; G06F1/28 ; G01R31/28
摘要：
A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be configured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.
公开/授权文献
- US20180321313A1 COMPONENT COMMUNICATIONS IN SYSTEM-IN-PACKAGE SYSTEMS 公开/授权日：2018-11-08
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