- 专利标题: Thin-film piezoelectric-material element, method of manufacturing the same, head gimbal assembly and hard disk drive
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申请号: US16503494申请日: 2019-07-04
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公开(公告)号: US11411162B2公开(公告)日: 2022-08-09
- 发明人: Wei Xiong , Atsushi Iijima
- 申请人: SAE Magnetics (H.K.) Ltd.
- 申请人地址: HK Hong Kong
- 专利权人: SAE Magnetics (H.K.) Ltd.
- 当前专利权人: SAE Magnetics (H.K.) Ltd.
- 当前专利权人地址: HK Hong Kong
- 主分类号: H01L41/047
- IPC分类号: H01L41/047 ; H01L41/09 ; H01L41/18 ; H01L41/316 ; G11B5/48
摘要:
A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film, a lower piezoelectric-material protective-film being formed with alloy material, and an upper piezoelectric-material protective-film being formed with alloy material. The piezoelectric-material film includes a size larger than the upper electrode film, a riser end-surface and step-surface formed on a top-surface of the upper electrode film side. The riser end-surface connects smoothly with a peripheral end-surface of the upper electrode film and vertically intersects with the top-surface. The step-surface intersects vertically with the riser end-surface. The lower piezoelectric-material protective-film, and the upper piezoelectric-material protective-film are formed with alloy material including Fe as main ingredient and having Co and Mo, by Ion beam deposition.
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