Invention Grant
- Patent Title: Apparatus and method for interpolating between a first signal and a second signal
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Application No.: US16650036Application Date: 2017-12-15
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Publication No.: US11387841B2Publication Date: 2022-07-12
- Inventor: Ofir Degani , Rotem Banin , Assaf Ben-Bassat , Bassam Khamaisi , Gil Asa
- Applicant: Intel IP Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel IP Corporation
- Current Assignee: Intel IP Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: 2SPL Patent Attorneys PartG mbB
- Agent Yong Beom Hwang
- International Application: PCT/US2017/066555 WO 20171215
- International Announcement: WO2019/117932 WO 20190620
- Main IPC: H03K5/13
- IPC: H03K5/13 ; H03M1/82 ; H03K5/01 ; H03K5/00

Abstract:
An apparatus for interpolating between a first signal and a second signal is provided. The apparatus includes a first plurality of interpolation cells configured to generate a first interpolation signal at a first node. At least one of the first plurality of interpolation cells is configured to supply, based on a first number of bits of a control word, at least one of the first signal and the second signal to the first node. The apparatus further includes a second plurality of interpolation cells configured to generate a second interpolation signal at a second node. At least one of the second plurality of interpolation cells is configured to supply, based on a second number of bits of the control word, at least one of the first signal and the second signal to the second node. The apparatus additionally includes an interpolation circuit configured to weight the second interpolation signal based on a weighting factor, and to combine the first interpolation signal and the weighted second interpolation signal to generate a third interpolation signal.
Public/Granted literature
- US20210367610A1 APPARATUS AND METHOD FOR INTERPOLATING BETWEEN A FIRST SIGNAL AND A SECOND SIGNAL Public/Granted day:2021-11-25
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