发明授权
- 专利标题: Mounting substrate
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申请号: US16175884申请日: 2018-10-31
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公开(公告)号: US11367555B2公开(公告)日: 2022-06-21
- 发明人: Shingo Ito
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: JP Nagaokakyo
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Nagaokakyo
- 代理机构: Keating & Bennett, LLP
- 优先权: JPJP2017-038556 20170301
- 主分类号: H01F5/00
- IPC分类号: H01F5/00 ; H01F27/06 ; H01F41/04 ; H01F27/29 ; H04R9/00 ; H01F17/00 ; H05K1/16 ; B06B1/04 ; H04R9/06 ; H04R31/00 ; H01F27/28 ; H01F41/26 ; H05K3/24 ; H05K3/46 ; H05K3/10
摘要:
A mounting substrate includes a resin layer and a first conductor including a contact surface in contact with the resin layer. The first conductor includes a first surface facing toward the mounting surface and a second surface on a side opposite to the first surface and extends in a direction parallel or substantially parallel to the mounting surface. The first conductor has a difference of a maximum value and a minimum value of a distance between the first surface and the mounting surface smaller than a difference of a maximum value and a minimum value of a distance between the second surface and the mounting surface. The resin layer includes a resin wall portion surrounding an opening portion partially exposing the first conductor on the mounting surface side, and the first conductor includes an exposed portion defining a mounting electrode.
公开/授权文献
- US20190074127A1 MOUNTING SUBSTRATE 公开/授权日:2019-03-07
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