- 专利标题： Accommodating device for retaining wafers
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申请号： US17106402申请日： 2020-11-30
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公开(公告)号： US11355374B2公开(公告)日： 2022-06-07
- 发明人: Markus Wimplinger , Thomas Wagenleitner , Alexander Filbert
- 申请人： EV Group E. Thallner GmbH
- 申请人地址： AT St. Florian am Inn
- 专利权人： EV Group E. Thallner GmbH
- 当前专利权人： EV Group E. Thallner GmbH
- 当前专利权人地址： AT St. Florian am Inn
- 代理机构： Kusner & Jaffe
- 主分类号： H01L21/68
- IPC分类号： H01L21/68 ; H01L21/683 ; H01L21/67 ; H01L21/66
摘要：
A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.
公开/授权文献
- US20210104425A1 ACCOMMODATING DEVICE FOR RETAINING WAFERS 公开/授权日：2021-04-08
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