- 专利标题: Semiconductor device and method of manufacturing semiconductor device
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申请号: US16448901申请日: 2019-06-21
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公开(公告)号: US11352252B2公开(公告)日: 2022-06-07
- 发明人: Ki Yeul Yang , Kyung Han Ryu , Seok Hun Yun , Bora Baloglu , Hyun Cho , Ramakanth Alapati
- 申请人: Amkor Technology Korea, Inc. , Amkor Technology Inc.
- 申请人地址: KR Gwangju; US AZ Tempe
- 专利权人: Amkor Technology Korea, Inc.,Amkor Technology Inc.
- 当前专利权人: Amkor Technology Korea, Inc.,Amkor Technology Inc.
- 当前专利权人地址: KR Gwangju; US AZ Tempe
- 代理商 Kevin B. Jackson
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; B81C1/00 ; B81B7/00
摘要:
In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.
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