- 专利标题: Thermoelectric module
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申请号: US17306473申请日: 2021-05-03
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公开(公告)号: US11349055B2公开(公告)日: 2022-05-31
- 发明人: Su Jin Kim , Il Ha Lee , Dong Sik Kim , Byung Kyu Lim , Cheol Hee Park , Ki Hwan Kim
- 申请人: LG CHEM, LTD.
- 申请人地址: KR Seoul
- 专利权人: LG CHEM, LTD.
- 当前专利权人: LG CHEM, LTD.
- 当前专利权人地址: KR Seoul
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 优先权: KR10-2017-0076058 20170615
- 主分类号: H01L35/08
- IPC分类号: H01L35/08 ; H01L35/14 ; H01L35/16 ; H01L35/18
摘要:
A thermoelectric module that has excellent thermal, electric properties, can realize high joining force between thermoelectric elements and an electrode, and can maintain stable joining even at a high temperature.
公开/授权文献
- US20210273149A1 THERMOELECTRIC MODULE 公开/授权日:2021-09-02
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