- 专利标题: Electrical fuse formation during a multiple patterning process
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申请号: US16918053申请日: 2020-07-01
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公开(公告)号: US11348870B2公开(公告)日: 2022-05-31
- 发明人: Jiehui Shu , Xiaoqiang Zhang , Haizhou Yin , Moosung M. Chae , Jinping Liu , Hui Zang
- 申请人: GLOBALFOUNDRIES U.S. Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: GLOBALFOUNDRIES U.S. Inc.
- 当前专利权人: GLOBALFOUNDRIES U.S. Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Thompson Hine LLP
- 代理商 Anthony Canale
- 主分类号: H01L23/528
- IPC分类号: H01L23/528 ; H01L21/768 ; H01L23/525
摘要:
Interconnect structures and methods of fabricating an interconnect structure. A first interconnect and a second interconnect extend in a first direction in a interlayer dielectric layer and are spaced apart from each other. A third interconnect is arranged in the interlayer dielectric layer to connect the first interconnect with the second interconnect. The first interconnect and the second interconnect have a first width, and the third interconnect has a second width that is less than the first width.
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