Invention Grant
- Patent Title: SDIO chip-to-chip interconnect protocol extension for slow devices and power savings
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Application No.: US16938845Application Date: 2020-07-24
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Publication No.: US11334402B2Publication Date: 2022-05-17
- Inventor: Rudhresh Kumar , Mamta Desai , Dhamim Packer Ali , Thirupathi Venkatarajan , Santan Kumar
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Priority: IN201941036366 20190910
- Main IPC: G06F9/54
- IPC: G06F9/54 ; G06F9/30 ; G06F13/40 ; G06F9/46
Abstract:
A method of improving synchronization over a secure digital (SD) bus between an SD host and an SD client device is described. The method includes writing to a client event register to interrupt the SD host for an SD extended command. The method also includes triggering the SD host to issue the SD extended command to the SD client device over the SD bus in response to the SD client device writing to the client event register.
Public/Granted literature
- US20210073053A1 SDIO CHIP-TO-CHIP INTERCONNECT PROTOCOL EXTENSION FOR SLOW DEVICES AND POWER SAVINGS Public/Granted day:2021-03-11
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